Adaptec aha 2930cu
Adaptec aha 2930cu.
SanDisk begins mass production of 43nm MLC NAND memory
SanDisk Corp. Announces Mass Production of 43nm Multi-Level (MLC) NAND Flash Memory. The corresponding workflow was developed jointly with Toshiba. Shifting to 43nm technology reportedly doubles memory density over 16Gb 56nm chips. Thus, it is possible to reduce the cost of production.
During the second quarter, SanDisk intends to begin shipping finished products using MLC NAND memory chips, the industry’s highest density. Customers will be the first to receive products based on 16 Gbit chips, and in the second half of the year the company promises to master 32 Gbit chips.
Mastering the technology was entrusted to the Toshiba production headquartered in Japan. During the collaboration, SanDisk and Toshiba have implemented a large number of collaborative MLC NAND developments at these facilities and share their products. In Phase 1, 43nm flash will be releasing Fab 4, a recently launched production facility that uses 300mm wafers. In the second half of the year, Fab 3 is also planned to be converted to 43 mm.
Recall that by the end of 2021, Toshiba hopes to begin mass production of flash memory at 30 nm.