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AMD will also use high-k dielectrics, but has not yet decided when

According to the source, contrary to rumors, AMD plans to roll out mass production of 45nm chips in the first half of 2021. Interestingly, AMD does not reject the possibility of using dielectrics with a high dielectric constant (high-k) and metal gates in transistors already in this generation of products, and not in the 32nm generation, as previously assumed. Recall that the corresponding achievements of IBM and AMD became known at the beginning of this year.

Reserving the possibility of technological maneuver, the manufacturer does not seem to have any particular concerns about the success of its main competitor, Intel, due to the transition to the use of dielectrics with a high dielectric constant and metal gates in transistors. As you know, 45nm Intel chips appeared in November.

AMD spokesman John Pellerin, who is leading the new technology project with IBM, said at the International Electron Device Meeting that the company expects to begin shipping new processors in the second half of next year. According to Pelerin, the company is focusing more on applications for its products, rather than on the technology race itself.

AMD’s first 45nm line already deployed at Fab 36 in Dresden. According to Pelerin, the company is satisfied with the achieved percentage of product yield.

As you know, the cooperation between AMD and IBM in the development of new technologies began in 2021. The original agreement was recently extended until 2021. It covers the development of 45- and 32-nm process technology. The main emphasis in cooperation is on R&D.

At the moment, the 32-nm process technology, according to Pelerin, is at a fairly advanced stage. In particular, the results of the work were transferred to Dresden for the release of prototype chips. Serial production at 32 nm should begin around 2021.

Source: EE Times

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