Intel r 7 series chipset family sata ahci controller.Intel® Rapid Storage Technology (AHCI) for Windows 7*/8*/8.1* for Intel® NUC

 

Intel r 7 series chipset family sata ahci controller

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Available Downloads.Downloads for Chipsets

 

2 Switch on your new hdc hardware. 3 Right click on the My computer icon and push Properties tab then. Choose Hardware tab. Click on Device Manager button. 4 Find your Intel (R) 7 Series Chipset Family SATA AHCI Controller device in the list and press double click on the hdc device. Detailed Description. Purpose. Installs the Intel® Rapid Storage Technology (AHCI) driver version for Intel® NUC. Which file to choose. Download the driver (STOR_Win7_8__exe) and one of the following F6 Driver Diskettes (depending on your operating system): STOR_Win7_8___f6flpy-xzip – for bit. Jan 04,  · Download driver Intel(R) 7 Series/C Chipset Family SATA AHCI Controller – 1E

 

Intel r 7 series chipset family sata ahci controller.Download driver Intel(R) 7 Series/C Chipset Family SATA – Microsoft Community

2 Switch on your new hdc hardware. 3 Right click on the My computer icon and push Properties tab then. Choose Hardware tab. Click on Device Manager button. 4 Find your Intel (R) 7 Series Chipset Family SATA AHCI Controller device in the list and press double click on the hdc device. This utility installs an updated version of the Intel® 7 Series Chipset Family SATA AHCI Controller to resolve an issue where the SATA driver may become unstable and display a blue screen. AHCI Supported Chipsets. x. Close Window. Advanced Host Controller Interface (AHCI) is an interface specification that allows the storage driver to enable advanced Serial ATA (SATA) features like Native Command Queuing and hot swap. AHCI is built into chipsets with the following controller hubs.
 
 
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Download driver Intel(R) 7 Series/C216 Chipset Family SATA AHCI Controller – 1E02
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Nextreme suggests using nanofilm to cool chips

Heat dissipation is one of the most pressing problems in modern integrated circuits. According to Nextreme, its specialists managed to solve the problem of efficiently removing heat from microcircuits that use the flip-chip method.

Modified contact pads are used for heat dissipation. In the development of Nextreme, they, in addition to performing their main function of electrical connection, help transfer heat outside the chip. Each contact has a built-in thermoelectric element that can cool the chip or convert thermal energy into electrical energy. Contact pads acquire the appropriate properties due to the thinnest thermoelectric film embedded in them. When current passes through the lead, one side of the nanofilm cools faster than the other, creating a temperature difference. This, in turn, speeds up heat dissipation.

The process works in the opposite direction – then the temperature difference becomes a source for obtaining electric current.

Nextreme says a 60 ° C temperature gradient can be achieved with a current flowing through a cell as small as 60 microns. This provides the ability to dissipate 150 watts of heat per square centimeter, which is ten times the value of 15 watts / sq.cm typical of today’s flip chip technology.

As for the electric generators using the new technology, they are also very efficient: the same difference of 60 ° C allows you to generate more than 3 watts of electrical energy per square centimeter of surface. This is approximately equal to 10 mW per pin.

Development is currently being tested. Pilot application in production will begin before the end of this year. Applications include microprocessors, display control ICs, RF ICs, and mixed signal processing ICs.

Source: Nextreme

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